Another week is done, so let's recap it. Starting with the iPhone 13 and 13 Pro, which will have bigger camera islands, due to their better camera hardware. The entire iPhone 13 series are also going to be slightly thicker.
Asus unveiled the petite Zenfone 8 and the larger Zenfone 8 Flip with a rotating triple camera system. The pair is already available in Europe and Taiwan.
We saw renders of the upcoming Huawei P50 series, which show three camera sensors in one camera ring and a separate one for the rumored 1-inch main camera. Currently the closest to that coveted 1-inch size is the 1/1.12-inch Samsung sensor that adorns the Xiaomi Mi 11 Ultra. The Huawei P50 is expected to have a 13-90mm equivalent camera setup. The renders don't clearly show a periscope, so we could be looking at a variable-zoom lens, similar to the one on the Sony Xperia 5 III and 1 III.
The Google Pixel 6 series broke cover with a couple of renders of what's allegedly the Pixel 6 and Pixel 6 Pro. The pair has adopted a unique design with an orange accent color. We see two cameras on the Pixel 6 and three on the Pixel 6 Pro - no word on sensors or specs, but the renders clearly show we shouldn't expect a periscope.
Sony's upcoming noise-cancelling earbuds - the WF-1000XM4's leaked in detailed images, showing both earbuds and the case. The earbuds look more compact than their predecessors. They should arrive on June 9, possibly featuring high-res audio.
Those were the key stories of the week - the full list is below. See you in a week!
Apple is expected to bring camera parity across its upcoming Pro models.
We are still waiting for the first audio wearable by the company with ANC.
The Zenfone 8 is smaller than the Xperia 5 III. The Flip is a Zenfone 7 with a Snapdragon 888 and a few other tweaks. Available for pre-order today.
The M1-powered tablet shows performance comparable to laptops with a 15W Intel or AMD processor.
The render shows what the camera setups inside the rings may look like.
Another source has confirmed the looks, while saying the colors aren't accurate.
The Pro has an NFC-enabled variant, both are powered by the Helio G95 chipset.
The upcoming TWS earphones bring a more round and compact design with a slimmer charging case.
The phone was photographed in China and it appears to be a lower cost alternative to the Galaxy A52 5G with similar specs.
The US Defense Department decides to back down after a lawsuit, filed in US courts.
The Reno6 series is expected to launch on May 22 in China.
Previously, Sony believed that the supply shortage will end in the second half of this year, but later it told analysts that shortages will last through 2022.
It will feature a MediaTek Dimensity chipset and a high refresh rate screen.
The two models will be unveiled at the next Unpacked event alongside the new foldables.
And perhaps tablets and even phones too. The chip will replace the Snapdragons currently used in Samsung's Windows-on-ARM laptops.
Both devices only have passive cooling for the M1 chipset, but the laptop managed to keep clock speeds slightly higher.
The XM4 generation will be noticeably more compact than the current XM3 TWS buds.
Following the new iMac design language.
Orders are expected to ship from June 11.
Both phones are getting the One UI 3.1 (Core) treatment.
The phone was released in other markets with MIUI 12, which is now being upgraded.
The Plus moniker has had a short life in the rumor mill.
Apple acquired Intel's modem division in 2019 and invested €1 billion in an R&D facility in Germany to develop its own 5G tech.
May 16, 2021 at 10:41PM
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Week 19 in review: Zenfone 8/8 Flip are here, look at the Huawei P50, Pixel 6 - GSMArena.com news - GSMArena.com
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